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Lead Free Wave Soldering Machine manufacturers
Wave soldering HP-450/350
The HB Advantages:
● HB has a long tradition of providing quality equipment and service.
● Lifetime free software upgrades.
● Lifetime free training at any HB factory.
● More standard features than other oven available in the market.
HP Series of Lead Free Wave soldering System
Heavy, Duty, High temperature Pumps and motors
Dual, High-performance high-temperature motors pump the molten solder through a titanium alloy recirculating system and wave nozzles that are specially designed to minimize solder oxidation. Both motors include transducer-controlled flow adjustment to ensure precise wave height and uniformity.
Main Features:
● Dual wave standard and high throughput and reliable, defect-free performance
● High capacity of solder pot
● Built inside flux spraying system
● Force convection hot air preheating zone
● Full titanium alloy conveyor finger for lead free
● Friendly HMI for ISO management
● Low cost of the ownership
● Comprehensive warranty
● Nitrogen system(Option)
● Center support system(Option)
● PC control adjustment system(Option)
Built in Spraying flux system. Standard.
A self cleaning nozzle and pressure tank flux delivery system are included.
The flux supply and flux flow meter are also as the standard configurationin the system which allow to save the flux consumption and make guaranty of spraying uniformity.
Forced convection hot air preheating zone
There is a three zones, high capacity, forced hot air convection preheater with independent Zone temperature controls to allow precise thermal profiling for proper flux activation and optimal solder wetting as assemblies enter the wave module. Each one-piece preheat module is designed to be interchangeable and easy drop-down removal, promoting the ultimate in process flexibility.
Micro air circulation design in the machine is to realize the more uniform heating effect. You can also control the speed motor of convection at preheating.
Titanium Finger Conveyor includes Motorized Width Adjustment
Motorized conveyor width adjustment, from 50~350mm (option: 450mm), is standard on all HP wave soldering systems, dramatically reducing setup time and eliminating operator inconsistency. Other conveyor widths are available: 300mm,450mm
An aluminum alloy pin-type conveyor input mechanism feeds the dual-titanium finger conveyorwhich includes a built-in finger cleaner,closed-loop speed control and overload protection.
Conveyor angle is adjustable from 40~70 and nominal speed setting is variable from 0~2.2m/min (0''~87''/min) for maximized throughput.
An optional center PCB support rail be added to maintain planarity and to prevent sagging of
oversize boards through the wave module.
A special recycle liquid brush finger cleaner and inlet conveyor are provided as standard.Easily
removable titanium fingers make maintenance simple.
This system includes user-friendly control software that provides a graphical representation
Of all system components,zone temperature settings, actual temperatures and belt-speed.
Security password protection prevents unauthorized changes;Pre-program the weekly operating schedule is available.
Standard Equipment
● Main conveyor
● Solder pot roll-out/in and up/down system
● Preheating system
● Solder pot system
● Built-in flux spraying system
● Finger cleaning system
● Inlet feeder
● Forced air cooling system
● Air exhaust
● Signal tower
Dimension (L*W*H) mm4430*1620*1710
Weight (kg )2300
Power supply3P5W,380V/220V,50/60HZ 63A
Startup power26 kw
Operation power consumption12kw
Control systemSiemens PLC+Computer
Spray system
Transmission methodStepping motor
Sprayer nozzleJapan ST-6
Spray pressure0.25MPa – 0.4 Mpa
FLUX flow arrange10-100ml/min
FLUX supplyAutomatic
Exhaust airUp exhaust
Exhaust capacity25M3/min
Preheating system
Preheating methodHot air
Control modePID+SSR
Preheating zonesLength:1800mm Room temperature~250°C
Warmingup time15 minutes ( setting 150°C )
Conveyor system
PCB Width (L*W) mmMin: 80*60;Max:500*450
PCB Conveyor directionLàR/ RàL (optional )
PCB Conveyor height (mm)750+/- 20
Conveyor speed (mm/ min )0-2000
Available components height (mm)Top :120mm ( 160mm Optional ) Down: 15 mm
FingerSpecial Titanium Claw
Rail width controlAuto
Conveyor angle4°—7°
Soldering system
Soldering Pot styleMotor drive
Solder pot materialTitanium alloy
WaveDuble wave
Wave height adjustDigital control by PC
Heater power380AC 12KW
Solder pot capabilityHW-450: Pb-Free 480kg
Solder pot temperature300°C
Solder pot warm-up timeApprox.180 min ( setting 250°C)
Temperature control modePID+SSR
Cooling systemForced air cooling
OthersFinger cleaning system; Return Trip lifting( Standard )
OptionalTop IR pre-heating,Nitrogen system, Center supportLead Free Wave Soldering Machine manufacturers

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